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Fibocom Launches the Industry-first SC151-GL at MWC Shanghai 2023, Accelerating the Global 5G AIoT Commercialization with One Highly Integrated Smart Module

  • Written by PR Newswire
Fibocom Launches the Industry-first SC151-GL at MWC Shanghai 2023, Accelerating the Global 5G AIoT Commercialization with One Highly Integrated Smart Module

During MWC Shanghai 2023, Fibocom announces the launch of its 5G smart module SC151-GL empowered by the Qualcomm® QCM4490 Processor. The global version of SC151-GL aims to provide a "one unit fits for world" solution for 5G AIoT markets, and enables the access of mobile smart terminals to the 5G service anywhere, anytime.

SHANGHAI, June...